BGA (Ball Grid Array)
Ball Grid Array (BGA) is a popular surface-mount packaging technology for integrated circuits (ICs), known for its high-density interconnects, excellent electrical performance, and reliable thermal management.
A BGA package consists of:
- A chip or die mounted on a substrate
- An array of tiny solder balls on the underside
- Electrical connections between the die and the PCB through these solder balls
Unlike traditional leaded packages (like QFP or DIP), BGA replaces pins with solder balls, enabling more connections in a smaller area and improving signal integrity and heat dissipation.
Related Articles
- Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
- 3D integration of pixel readout chips using Through-Silicon-Vias
- Efficient ESD Verification For 2.5/3D Automotive ICs
- Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators
Featured Content
- AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
- GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
- Affinity Tailor: Dynamic Locality-Aware Scheduling at Scale
- TSMC SoIC roadmap targets 2029 chip stacking
- Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
- AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity
- Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026
- SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
- Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out
- Addressing AI and Advanced Packaging Challenges with Synopsys 3DIO PHY
- AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving
- How to accelerate innovation in IC technology with chiplets and 3D ICs
- Exploring the Efficiency of 3D-Stacked AI Chip Architecture for LLM Inference with Voxel
- Epoxy Composites Reinforced with Long Al₂O₃ Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging
- Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures