Chiplet Technical Library

Affinity Tailor: Dynamic Locality-Aware Scheduling at Scale

By Jin Xin Ng, Google

May 4, 2026

AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving

By Zhongkai Yu, University of California

April 30, 2026

Exploring the Efficiency of 3D-Stacked AI Chip Architecture for LLM Inference with Voxel

By Yiqi Liu, University of Illinois Urbana-Champaign

April 30, 2026

Epoxy Composites Reinforced with Long Al₂O₃ Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging

By Zihao Lin, Georgia Institute of Technology

April 29, 2026

Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026

By Mick Posner, Cadence and Kevin Yee, Samsung Foundry

May 2, 2026

How to accelerate innovation in IC technology with chiplets and 3D ICs

By

April 30, 2026

Automated Multiphysics for 3D IC Success

By Shetha Nolke and John Ferguson

April 28, 2026

Tying Together Chiplets using Network-on-Chip

By Kent Orthner

April 16, 2026

THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect

By Socionext

April 14, 2026

In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry

By ProteanTecs

April 14, 2026

Chiplets for Automotive, Industrial, and Aerospace Applications

By Fraunhofer IIS

March 27, 2026

Designing the Future Today: AI-Driven Multi-Die Design

By Synopsys

March 27, 2026