Why Chiplets Need a “Beyond IP” Management Approach
By Keysight Technologies
By keeping all data and IPs within a unified platform, businesses can mitigate the risk of siloed information and ensure that all team members can access the latest, accurate versions.
Chiplets are making big waves in the semiconductor industry, with global market size expected to grow 71.3% from 2023 to 2031. With integration of multiple technologies, semiconductor design teams are reinvigorating Moore’s Law, by paving the way for designs featuring multi-billion transistors and hundreds of semiconductor intellectual properties (IPs).
However, powerful chiplet-based architectures have also introduced a new level of complexity in managing intellectual properties (IPs), from stringent export controls to compliances and IP security risks.
To navigate these complexities, companies need to adopt a comprehensive approach to IP lifecycle management, one that encompasses more than just the IP itself and considers a holistic perspective of its lifecycle. Keysight Director of Product Management, Simon Rache, talks about the challenges associated with IP management for chiplet projects and how design teams can improve IP security and compliance.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- How and Why Chiplets are Growing in Use and Need
- Why China is betting big on chiplets
- Why Chiplets Are So Critical In Automotive
- Why chiplets will transform electronic system design
Latest News
- Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
- AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
- GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
- TSMC SoIC roadmap targets 2029 chip stacking
- Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX