Why chiplets will transform electronic system design
By Designing Electronics North America
The transition to chiplets is a seismic shift that will send shockwaves throughout the industry.
Highly integrated monolithic semiconductor devices have provided a stable foundation for rapid innovation in the electronics industry for many decades now. However, that foundation is starting to show signs of cracking as a new wave of chiplet- based devices begins to take hold. Understanding the significance and implications of chiplets will be critical for successful design development in the future, particularly for the rapidly-growing edge IoT and AI/ML markets.
How chiplets came to be
The use of chiplets can be traced back to the growing complexity of electronic systems. To support this tendency, monolithic semiconductors have correspondingly become more complex, with the largest devices being built today incorporating more than 100 billion transistors. However, building ever larger and more complicated devices creates a host of issues including long design and verification times, high development costs, high device costs, and thermal management problems. A powerful solution to that problem is to modularize the design, development, and production of devices by means of chiplets.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Cadence Rolls Out System Chiplet to Reorganize the SoC
- Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform
- Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
- U.S. Navy Funds Mercury to Advance Chip-Scale Technologies Needed to Reduce Electronic Warfare Design Timelines
Latest News
- NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries
- Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
- Open EU Foundry status granted to innovative chiplet facility
- Siluxtek and GlobalFoundries Forge a Deep Strategic Partnership to Mass-Produce 200G/Lane Silicon Photonic Receiver Chips, Paving the Way for the Industrial Revolution of AI Computing Interconnects
- Lightwave Logic High-Speed Modulator Platform Now Available in GDS Factory PDK for GlobalFoundries Silicon Photonics Platform