What Comes After HBM For Chiplets
By Brian Bailey, SemiEngineering (September 18th, 2024)
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys. What follows are excerpts of that discussion, which was held at the Design Automation Conference.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- What could back an open market for chiplets?
- What are the challenges when testing chiplets?
- What Works Best For Chiplets
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
Latest News
- NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries
- Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
- Open EU Foundry status granted to innovative chiplet facility
- Siluxtek and GlobalFoundries Forge a Deep Strategic Partnership to Mass-Produce 200G/Lane Silicon Photonic Receiver Chips, Paving the Way for the Industrial Revolution of AI Computing Interconnects
- Lightwave Logic High-Speed Modulator Platform Now Available in GDS Factory PDK for GlobalFoundries Silicon Photonics Platform