IMAPS CHIPcon Recap – What You Need to Know About Chiplets in 2025

By Jillian McNichol, 3DIncites | July 14, 2025

Although the idea of chiplets has been around for a little while, broad industry interest around the technology really took off around 2018, when AMD released its second generation EPCY processors. Since then, Google searches for chiplets have skyrocketed, and the advanced packaging industry is beginning to seriously consider chiplets as a viable solution to cost, scalability, and flexibility challenges posed by standard system on chips (SoCs).

To provide some quick context, chiplets are small integrated circuits that can be combined with other chiplets to create more customizable and complex SoCs. They offer the freedom to spend money on areas where more advanced technology is needed, while saving money where it’s not.

So, to address the uptick in chiplet interest, IMAPS established its CHIPcon conference and exposition. From July 7-10 in San Jose, California, chiplets took center stage. With roughly 180 attendees and 17 exhibitors, this hyper-focused conference touched on everything from AI inferencing and chiplet cost considerations, to standardization, ownership, and more.

If you didn’t get a chance to attend, here’s what you missed.

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