Chiplets drive new automated design tools at Leti
By Nick Flaherty, eeNews Europe (June 26, 2024)

CEA-Leti has shown a scalable chiplet architecture for automotive and developed new automated tools for design exploration.
The move to software defined vehicles and zonal architectures is also driving the need for chiplets and new design tools at French research group Leti in Grenoble.
“Two years ago we started a feasibility study with a big automotive OEM to define and specify the high level architecture of E/E architectures and at that time there were only two solutions: a SDV based on a GPU and a discrete solution,” said Denis Dutoit, programme manager for advanced computing and chiplets at CEA-Leti.
This chiplet architecture was described at the Leti Innovation Day today.
“This architecture will require a new design methodology as the design space is so huge the traditional way of designing system is no longer valid,” he said.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Chiplets diary: Three anecdotes recount design progress
- Why chiplets will transform electronic system design
- CEA-Leti Develops Active Optical Interposers to Connect Chiplets
- Chiplets: Revolutionizing Semiconductor Design and Manufacturing
Latest News
- Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies
- Marvell Completes Acquisition of Celestial AI
- Chiplet Summit Announces Keynote Speakers
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems