Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.
To read the full article, click here
Related News
- Chiplet Interconnects Add Power And Signal Integrity Issues
- Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems
- How do UCIe and BoW interconnects support generative AI on chiplets?
- How can in-package optical interconnects enhance chiplet generative AI performance?
Latest News
- Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies
- Marvell Completes Acquisition of Celestial AI
- Chiplet Summit Announces Keynote Speakers
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems