Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up 2025-08-28 11:33:00 Standards & Research
Athos Silicon Chief mSoC™ Architect Francois Piednoel to Present the IEEE World Technology Summit 2025 in Berlin 2025-08-27 06:37:00 Other
Marvell Unveils Industry’s First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs 2025-08-26 13:25:00 Chiplet-Ready IP
Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics 2025-08-25 11:34:00 Interconnects & Integration
Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers 2025-08-25 05:50:00 Standards & Research
NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium 2025-08-20 03:20:00 Other
Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates 2025-08-18 12:29:00 Analysis & Commentary
Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology 2025-08-15 05:49:00 Business & Deals
ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion 2025-08-15 04:19:00 Business & Deals
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers 2025-08-14 05:47:00 Ecosystem & Strategy
Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA 2025-08-13 13:13:00 Design, Tools & Validation
Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing 2025-08-13 12:58:00 Business & Deals
Rigetti Computing Reports Second Quarter 2025 Financial Results; Announces General Availability of its 36-Qubit Multi-Chip Quantum Computer 2025-08-13 08:43:00 Business & Deals
AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development 2025-08-12 15:12:00 Other
Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user 2025-08-12 13:14:00 Design, Tools & Validation
Open Compute Project Enables Silicon Diversity in AI Clusters 2025-08-07 07:05:00 Standards & Research
UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability 2025-08-05 12:42:00 Standards & Research
Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs 2025-08-05 03:59:00 Business & Deals
Meeting the Cleaning Challenges of High-density 3D Heterogeneous Integration Applications 2025-08-04 13:24:00 Analysis & Commentary