Chiplets and Automotive Computing – Interview with Bart Placklé, Imec
Chiplet architectures are redefining the automotive industry. Imec’s Bart Placklé explains how modular design, interoperability, and ecosystem collaboration can help Europe regain leadership in high-performance vehicle computing.
By Benjamin Müller, Automotive Digital Transformation | November 4, 2025
With more than two decades of experience in automotive and semiconductor technology, Bart Placklé has shaped some of the most fundamental transformations in the industry – from infotainment consolidation and domain controller evolution to Intel’s early autonomous mobility programs. As Vice President Automotive at Imec, he now leads efforts to advance chiplet integration as a foundation for next-generation high-performance automotive computing.
At the Automotive Computing Conference 2025, Placklé will speak about the structural and economic limits of traditional SoC design and why open, interoperable chiplet ecosystems are the key to scalable, sovereign computing in Europe. In the run-up to the conference, we spoke with him about the technological and structural shifts driving the future of automotive computing.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Strategic alignment between imec and Japan’s ASRA aims to harmonize standardization of automotive chiplet architectures
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Arteris Addresses Silicon Design Reuse Challenge with New Magillem Packaging Product for IP Blocks and Chiplets
Latest News
- Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies
- Marvell Completes Acquisition of Celestial AI
- Chiplet Summit Announces Keynote Speakers
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems