Bridging the Gap to Chiplet Interoperability
The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as key enablers of future designs.
Chiplets have emerged as a dominant theme in discussions of next-generation system architectures. The current narrative describes a vision where design teams can mix and match dies from different sources, using standard interfaces and simplified flows to build multi-die systems.
The analogy to off-the-shelf IP components is often cited, with chiplets expected to become as accessible and interoperable as passives or even microcontrollers. However, while compelling, this narrative is still a long way from reality.
The Current Landscape of Chiplet Integration
Chiplets typically fall into two architectural categories: homogeneous scale-out and heterogeneous disaggregation. Homogeneous designs use multiple identical dies within a package to expand performance capacity, while heterogeneous approaches combine functionally distinct dies tailored to specific roles.
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Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Blogs
- UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall
- Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
- Redefining SoC Design: The Shift to Secure Chiplet-Based Architectures
- Introduction to Chiplets: Why the Industry is Moving Beyond Monolithic Designs