Six critical trends reshaping 3D IC design in 2026

By Kevin Rinebold

February 17, 2026

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up. Increasingly, engineering teams are turning to 3D ICs to keep pace with the ascent of next-gen AI scaling.

However, designing in three-dimensions also exacerbates system complexity, leaving IC and package designers with a pressing question: how do you explore millions of design considerations and still optimize and validate system performance within schedule constraints?

This article examines six trends that will help design teams overcome this challenge and help them reshape the future of 3D IC design in 2026.

To read the full article, click here