OCP Open Chiplet Economy is Leading the Next Wave of AI: Inference

Arm Led Foundational Chiplet System Architecture Specification is Now Available

Open Compute Project Foundation (OCP), the nonprofit international  organization bringing at-scale innovations and hyperscale best practices to all, today announced the release of Arm Led Foundational Chiplet System Architecture Specification (FCSA). FCSA will play on important role in enabling standardized chips that fit everywhere for silicon diversity, which will be imperative for the next wave of AI focused on optimizing AI inference at points-of-presence near the user, and in regional and hyperscale cloud data centers

The Foundation Chiplet System Architecture (FCSA), a vendor-neutral specification derived from Arm Chiplet System Architecture (CSA). FCA establishes a common baseline for partitioning monolithic systems into interoperable Chiplets, enabling use across any processor architecture, including memory, I/O, and accelerators. Enabling a combination of low-cost chips that meet the needs of particular environments, applications, and pave the way to success.

FCSA is a baseline for how System-in-Package (SiP) designers can decompose monolithic SoCs into Chiplets, specifying common partitioning approaches that can span processor architectures. This will help the industry maximize the re-use of Chiplets, lead to wider choice of compatible IP blocks, enable common design and validation tooling, and maximize flexibility and choice by avoiding lock-in to proprietary Chiplet standards.

“The AI transformation within the data center is well underway with new inference architectures still emerging to drive performance. To deliver on the range of training and inference use cases across industries, accelerated compute infrastructure should be deployed where data is created and consumed by people. Making this practical will require silicon customized for many use cases, this is where the Open Chiplet Economy Project at OCP will play a critical role,” said Cliff Grossner, Ph.D., Chief Innovation Officer at OCP.

The Open Chiplet Economy continues to grow following the launch of the OCP Chiplet Marketplace in 2024, providing a catalogue of Chiplets, design tools, and services. With the FCSA ecosystem joining the OCP Marketplace, OCP further enables open, interoperable approaches to chiplet-based design, creating opportunities for companies of all sizes to innovate and collaborate.