Silicon Box’s Business Head on how chiplet architecture transforms semiconductor scalability

By Sainul Abudheen K, e27 (January 29, 2024)

In a detailed interview, Silicon Box's Head discusses how chiplet architecture transforms semiconductor scalability, fosters industry collaboration, and fuels global expansion

Singapore-based Silicon Box enables chiplet architecture, allowing chip designers freedom from the constraints of a single, monolithic chip for processing. By leveraging multiple smaller chips interconnected in a single package, chip designers can create the equivalent of a system-on-a-chip (SoC) in a package.

The company recently raised US$200 million in Series B funding from BRV Capital, Event Horizon Capital, Maverick Capital, and others, intending to reshape the semiconductor landscape. The capital will primarily go into expanding production in its US$2-billion packaging factory in Singapore.

In this interview with e27, Michael Han, Silicon Box’s Head of Business, discusses the impact of capital injection on factory expansion and the opportunities and challenges of the company.