Polar Bear Tech secures new funding to develop first independent chiplet product library
Beijing (Gasgoo)- June 12, 2024 -- Recently, Chinese chiplet design company Polar Bear Tech announced the completion of a new round of financing, introducing V Fund as an investor. The funds will be primarily used for the initial batch of core chiplet tape-outs and packaging tests, propelling the company to establish China's first independently marketable chiplet product library.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- PseudolithIC Inc. Raises $6M in Seed Funding to Revolutionize Wireless Chips with Proprietary Chiplet Heterogeneous Integration Technology
- Keysight Expands Chiplet Interconnect Standards Support in Chiplet PHY Designer 2025
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
Latest News
- Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
- AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
- GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
- TSMC SoIC roadmap targets 2029 chip stacking
- Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX