Onshoring Advanced Packaging Update
By Francoise von Trapp, 3DInCItes | April 08, 2025
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
During GTC week, Huang stated that Nvidia ultimately plans to shift manufacturing onshore, and according to Nvidia’s annual report, they have $20 billion in purchase commitments as of January 28 last year. One would assume that the majority of purchase commitments are with TSMC, which, with Nvidia’s $130 billion in revenues for the 2024 calendar year, is close to a year’s supply of chips. Nvidia is reportedly already manufacturing chips at TSMC’s Arizona site; however, these chips are then shipped to Taiwan to get packaged.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
- SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores
- Biden-Harris Administration to Invest Up to $1.6 Billion to Establish and Accelerate Domestic Capacity Advanced Packaging
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
Latest News
- AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
- GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
- TSMC SoIC roadmap targets 2029 chip stacking
- Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
- AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity