NHanced Project Puts U.S. on Advanced-Packaging Map

EXCLUSIVE INTERVIEWS

By Alan Patterson, EETimes (January 26, 2024)

NHanced Semiconductors’ investment in hybrid bonding will make the company one of the first in the U.S. to offer advanced packaging services, the company president and experts told EE Times.

With its investment of several hundred million dollars, the company endeavors to put the U.S. back on the map in chip packaging, which today is primarily done in Asia. NHanced is aiming for the high end, using hybrid bonding to integrate chip dies with interconnect pitches in the range of 10 microns.

“When it comes to hybrid bonding of heterogeneous material, we are the only commercial supplier in the world,” NHanced President Bob Patti told EE Times. “We have probably a good three-year head start on anyone.”

NHanced will be among the first companies in the U.S. to do hybrid bonding, TechSearch President Jan Vardaman told EE Times.

U.S. Sen. Todd Young (R-Ind.), left, joined Nhanced CEO Bob Patti at the opening of an advanced packaging facility this month. (Source: NHanced)

“There is a shortage of silicon interposers and assembly for that because of the surprise demand from Nvidia’s AI play,” she said. “There are some companies in the U.S. that need a U.S. source of silicon interposers, and NHanced should be able to provide this.” 

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