JCET Accelerates Strategic Shift Toward High-End Advanced Packaging, 2025 Advanced Packaging Revenue Hits Record High

April 21, 2026 -- Driven by the surging demand for High-Performance Computing (HPC) and high-density storage, high-end advanced packaging has emerged as a primary catalyst for the evolution of the semiconductor industry. Capitalizing on this momentum, JCET Group has significantly accelerated its strategic expansion into high-end advanced packaging, achieving a historic milestone in 2025. The company’s revenue from advanced packaging services reached a record high of RMB 27.0 billion for the year.

Fueled by breakthroughs in high-end intelligent applications and the steady ramp-up of production capacity, JCET is successfully transitioning its advanced packaging capabilities to "large-scale, platform-based, one-stop delivery." For high-performance computing and storage scenarios such as HPC data centers, JCET has developed a systematic portfolio of packaging and testing solutions covering computing, storage, connectivity, and power management. These solutions, backed by robust manufacturing and engineering capabilities, continue to gain strong recognition from global customers.

As the industry evolves, high-end advanced packaging has become a strategic imperative for leading OSATs. JCET has consistently increased its investment in key technology R&D and mass production deployment. Through deep collaboration with global clients, the company has honed its core process and engineering competencies, establishing a distinct competitive advantage.

For intelligent computing center workloads, JCET’s XDFOI^® platform has entered HVM, offering multiple integration routes using RDL interposer, silicon interposer, and silicon-bridge approaches to address different requirements in interconnect density, cost, and system form factor. In co-packaged optics (CPO), JCET is advancing heterogeneous integration of optical engines with switching and compute ASICs. In power and energy applications, the company has achieved innovation and volume production for SiP-based 2.5D vertical VCORE power module packaging, and is expanding end-to-end packaging and test solutions for high-voltage HVDC architectures. In parallel, JCET is strengthening engineering capabilities in critical areas such as thermal management and reliability validation, supporting system-level integration requirements in high-compute designs.

Scale and financial performance remain the ultimate benchmarks of market success. In 2025, JCET reported record-breaking annual revenue of RMB 38.87 billion, with advanced packaging contributing a significant portion of this growth. On the manufacturing front, JCET has spent years upgrading its production systems to ensure that highly complex processes can be matured and optimized through large-scale operations. In 2025, the company’s wafer-level and other advanced packaging lines maintained high utilization rates, and the capacity expansion at JCET Microelectronics achieved substantial progress.

This large-scale delivery capability is underpinned by sustained, high-intensity R&D. In 2025, JCET’s R&D expenditure reached RMB 2.09 billion, a year-on-year increase of 21.37%. Over a longer horizon, R&D investment has grown from RMB 1.19 billion in 2021 to RMB 2.09 billion in 2025, representing a CAGR of approximately 15.1%. By focusing on critical technologies, JCET has developed a versatile range of solutions that are now in mass production across multiple sites. As of the end of 2025, JCET’s intellectual property portfolio surpassed 3,100 patents, including over 2,600 invention patents.

Looking ahead, JCET will remain committed to advanced packaging as its core strategic direction, continuing to enhance capacity utilization and operational efficiency to serve the global computing and storage industries.