Interconnect Essential To Heterogenous Integration

By Karen Heyman, SemiEngineering

Chiplet communication will be impossible without interconnect protocols.

Designing and manufacturing interconnects is becoming more complex, and more critical to device reliability, as the chip industry shifts from monolithic planar dies to collections of chips and chiplets in a package.

What was once as simple as laying down a copper trace has evolved into tens of thousands of microbumps, hybrid bonds, through-silicon vias (TSVs), and even junctions for optical fiber. The main goal is still to get signals from point A to point B as quickly as possible with the least RC delay, using the lowest amount of power possible — all while ensuring those signals are intact and that they reach their destination. But making all of that work is a growing challenge.

To read the full article, click here