Edge AI chiplet uses SemiDynamics RISC-V cores
By Nick Flaherty, eeNews Europe (January 19, 2024)
YorChip is developing a chiplet for edge AI applications using RISC-V cores from Semidynamics in Barcelona.
The edge AI chiplet will use the SemiDynamics Atrevido quad core RISC-V IP and the UCIe standard interface. The four Atrevido 423 cores provide 10 Int8-TOPS per chiplet in a target technology of 12nm and a target die size under 25mm2.
SemiDynamics in Barcelona has developed series of configurable RISC-V vector processors for automotive, robotic, drones and other high-performance edge AI markets. YorChip is a Silicon Valley start-up aiming to developing a complete ecosystem of off the shelf focused on chiplets using proven partner IP and a novel die-to-die technology.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona
- EdgeCortix Awarded New 3 Billion Yen NEDO Project to Develop Advanced Energy-Efficient AI Chiplet for Edge Inference and Learning
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- EDGE and Lockheed Martin to Collaborate on Advanced Chiplet Design Capabilities
Latest News
- AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
- GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
- TSMC SoIC roadmap targets 2029 chip stacking
- Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
- AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity