Bringing Tiny Chiplets To Embedded SoCs
By Sally Ward-Foxton, EETimes (October 31, 2023)

LONDON — ZeroASIC has developed a technology platform to bring chiplets to embedded system design, as a time-efficient alternative to designing and manufacturing custom application-specific ICs (ASICs). The platform is based on swappable pre-fabbed 2 x 2 mm chiplets on an active silicon interposer, which customers can design for themselves in a matter of minutes using ZeroASIC’s online EDA tool.
The company’s aim is to reduce the barrier to making custom ASICs versus using off-the-shelf SoCs. ZeroASIC CEO Andreas Olofsson told EE Times that the biggest cost, in terms of both time and money, for custom ASICs is tapeouts.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Empower Semiconductor Showcases High-Density Power Chiplets and Embedded Integrated Voltage Regulators at APEC 2024
- Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
- On chip voltage regulator IP for chiplets and SoCs
- Alphawave Semi to Reveal Ecosystem and Key Architectures Unlocking Generative AI Potential at EE Times' "Chiplets: Building the Future of SoCs" Seminar
Latest News
- NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries
- Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
- Open EU Foundry status granted to innovative chiplet facility
- Siluxtek and GlobalFoundries Forge a Deep Strategic Partnership to Mass-Produce 200G/Lane Silicon Photonic Receiver Chips, Paving the Way for the Industrial Revolution of AI Computing Interconnects
- Lightwave Logic High-Speed Modulator Platform Now Available in GDS Factory PDK for GlobalFoundries Silicon Photonics Platform