SoCs Get a Helping Hand from AI Platform FlexGen
By Gary Hilson, EETimes | March 21, 2025

FlexGen, a network-on-chip (NoC) interconnect IP, is aiming to accelerate SoC creation by leveraging AI.
Developed by Arteris Inc., FlexGen promises to deliver a 10× productivity boost while reducing design iterations and the time required to develop. In a briefing with EE Times, Arteris CMO Michal Siwinski said FlexGen achieves up to a 30% reduction in wire length to lower power use, as well as up to 10% reduction in latency that results in improved performance in SoC and chiplet designs.
“It will actually do the process of generating that network on chip, generating that interconnect and it will actually generate however many interconnects are required to meet the requirement,” Siwinski said.
Using AI and machine learning for chip design isn’t new, Siwinski said, but often the productivity boosts come at the cost of performance or power. FlexGen is able to reduce the number of elements on the critical path of a project, while also improving power/performance metrics, which he said is unique.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
- Arteris Deployed by Menta for Edge AI Chiplet Platform
- Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
Latest News
- NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries
- Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
- Open EU Foundry status granted to innovative chiplet facility
- Siluxtek and GlobalFoundries Forge a Deep Strategic Partnership to Mass-Produce 200G/Lane Silicon Photonic Receiver Chips, Paving the Way for the Industrial Revolution of AI Computing Interconnects
- Lightwave Logic High-Speed Modulator Platform Now Available in GDS Factory PDK for GlobalFoundries Silicon Photonics Platform