AI and Chiplets Prominent at TSMC OIP 2025

By Majeed Ahmad, EETimes | September 26, 2025

The design tool offerings of the top three EDA houses showcased at TSMC’s annual U.S. event once more affirm the two defining trends in the current semiconductor landscape: artificial intelligence (AI) and chiplets. TSMC’s Open Innovation Platform (OIP) Ecosystem Forum brings together partners to demonstrate their design advancements of TSMC’s latest process nodes and packaging technologies.

The EDA trio’s announcements at the event encompass new AI flows and multi-die innovations relating to 3D IC, advanced packaging, and chiplets. The advancements in AI and chiplet realms are intertwined, paving the way for high-performance AI and HPC chips that serve compute-intensive workloads.

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