Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
By Ed Sperling And Laura Peters - Semiconductor Engineering (January 29th, 2025)
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
- EV Group Highlights Hybrid and Fusion Bonding, Layer Transfer and Maskless Lithography Technologies for Advanced Semiconductor Memory and Packaging at SEMICON Korea 2026
Latest News
- Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
- AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
- GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
- TSMC SoIC roadmap targets 2029 chip stacking
- Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX