Advanced Packaging Driving New Collaboration Across Supply Chain

Rising complexity is changing the way companies engage and interact, but long-standing barriers in communication, culture, and IP protection are slowing progress.

By Gregory Haley, SemiEngineering (October 24th, 2024)

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems.

At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. Heterogeneous approaches allow companies to combine different technologies — such as logic, memory, analog, and RF — into one package, improving both performance and cost efficiency. It also allows them to target specific domains or workloads, leveraging chiplets and pre-integrated modules that can be assembled into a unified system.

Chiplets enable companies to mix and match different silicon processes on separate dies. But achieving this modularity requires tight coordination across the ecosystem — from substrate design and interposer development to assembly and testing. Put simply, no single company can manage every aspect of the development cycle, no matter how large or advanced they are.

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