Chiplet Recent Updates - Page 26 of 47

DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses

2025-01-06 17:21:00

Business & Deals

Marvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Accelerators

2025-01-06 16:53:00

Chiplets

DreamBig Announces world leading 800G AI-SuperNIC chip (Mercury) with Fully HW Offloaded RoCE v2 + UEC RDMA Engine

2025-01-06 16:22:00

Chiplets

Opportunities Unleashed by Chiplet Technology: A New Era for the Semiconductor Industry

2025-01-06 15:52:00

Analysis & Commentary

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions

2025-01-06 09:51:00

Manufacturing & Supply Chain

SJSemi closed $700M new financing to further boost its Advanced Packaging projects

2025-01-02 10:18:00

Business & Deals

POET Completes Acquisition of Super Photonics Xiamen

2024-12-31 18:54:00

Business & Deals

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

2024-12-27 07:27:00

Interconnects & Integration

Test & Yield Challenges of Chiplet-Based Semiconductor Products

2024-12-24 07:49:00

Other

Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

2024-12-20 09:07:00

Chiplet-Ready IP

Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara

2024-12-19 18:55:00

Business & Deals

Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line

2024-12-19 15:48:00

Standards & Research

EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure

2024-12-19 10:02:00

Other

Cadence Rolls Out System Chiplet to Reorganize the SoC

2024-12-19 09:02:00

Analysis & Commentary

Fraunhofer IAF expands technology capabilities for chiplet innovations within the APECS pilot line

2024-12-19 08:30:00

Standards & Research

Lightmatter Joins UALink™ Consortium to Propel AI Interconnect into the Photonic Era

2024-12-18 15:15:00

Standards & Research

YES RapidCure Systems chosen by SkyWater Technology for Fan Out Wafer Level Packaging

2024-12-18 09:08:00

Interconnects & Integration

Report: SK Hynix mulls offering advance packaging foundry service

2024-12-17 09:11:00

Interconnects & Integration

European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act

2024-12-16 17:15:00

Standards & Research

The keeper of Moore’s Law

2024-12-15 07:27:00

Analysis & Commentary

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