What’s Missing In 2.5D EDA Tools

By Brian Bailey, SemiEngineering (March 28, 2024)

While it’s possible to create interposer-based systems today, the tools and methodologies are incomplete, and there is a mismatch with organizations.

Gaps in EDA tool chains for 2.5D designs are limiting the adoption of this advanced packaging approach, which so far has been largely confined to high-performance computing. But as the rest of the chip industry begins migrating toward advanced packaging and chiplets, the EDA industry is starting to change direction.

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