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Chip-on-Wafer-on-Substrate (CoWoS)

Chip-on-Wafer-on-Substrate (CoWoS) is an advanced semiconductor packaging technology developed to meet the demands of high-performance computing (HPC), AI processors, GPUs, and networking chips. CoWoS enables high-density integration, excellent thermal management, and superior electrical performance by stacking multiple dies on an interposer and connecting them to a substrate.

What Is CoWoS?

CoWoS is a 3D packaging technology where individual dies are mounted on a silicon interposer, which is then attached to a package substrate. The interposer provides high-density interconnects between dies, enabling:

  • High-speed communication
  • High I/O density
  • Reduced parasitics

CoWoS allows heterogeneous integration of memory, logic, and other chips in a single package, offering an ideal solution for applications that require extreme performance and bandwidth.

Key Advantages of CoWoS

1. High electrical performance

  • Ultra-short interconnects on the silicon interposer
  • Reduced latency and signal loss
  • Suitable for high-speed CPUs, GPUs, and AI accelerators

2. High I/O density

  • Silicon interposer enables thousands of connections in a small footprint
  • Supports advanced memory integration like HBM (High Bandwidth Memory)

3. Excellent thermal management

  • Interposer and substrate allow better heat dissipation
  • Ensures reliability in high-power computing applications

4. Heterogeneous integration

  • Combines logic, memory, and analog/RF components in a single package
  • Reduces board-level complexity

5. Scalability for high-performance systems

  • Supports multi-die stacking for servers, data centers, and AI workloads

How CoWoS Works: Process Overview

  1. Die preparation
    Chips and memory modules are prepared individually.

  2. Die-on-interposer placement
    Logic and memory dies are mounted on a silicon interposer.

  3. Through-silicon via (TSV) connection
    Vertical interconnects in the interposer connect stacked dies.

  4. Interposer-on-substrate assembly
    The interposer with dies is attached to the package substrate.

  5. Encapsulation and testing
    The package is molded, tested, and prepared for PCB assembly.

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