Baya Systems Strengthens Engineering Leadership to Accelerate Chiplet Implementation

April 16, 2026 -- At Baya Systems, we are focused on enabling our partners to accelerate the journey from architecture to silicon as AI and chiplet-based systems grow in complexity. As designs become more sophisticated, the challenge is not just defining the right architecture: balancing compute, memory, and interconnect for performance and scalability, but how quickly and reliably systems can be implemented and brought to life. Strengthening our engineering leadership is a key part of advancing our ability to support increasingly complex system requirements and deliver scalable, production-ready solutions.

Amal Bommireddy
SVP of Chiplet Engineering & Silicon Enablement.

We are pleased to welcome Amal Bommireddy as SVP of Chiplet Engineering & Silicon Enablement. Amal will lead Baya’s chiplet and physical design engineering efforts, working across architecture and implementation to expand our capabilities and support customers as they bring next-generation systems to life. He brings more than three decades of experience across leading Bay Area technology startups and is widely recognized for building and scaling high-performing engineering teams. At Baya, Amal will also help extend our engagement with customers and partners, enabling faster and more predictable paths from design to silicon.

As AI and chiplet-based systems scale, efficient implementation across increasingly complex architectures becomes critical to bringing designs to silicon. Strengthening our leadership in chiplet engineering and silicon enablement is critical to helping our partners move from concept to silicon faster and with greater confidence.
Sailesh Kumar, CEO of Baya Systems

We are also recognizing the continued growth of leaders within our organization.

Joji Philip

Joji Philip steps into the role of SVP of IP Engineering, where he leads IP architecture, roadmap, and delivery. In this role, Joji is focused on scaling Baya’s IP portfolio to meet the demands of next-generation systems and chiplet-based designs, ensuring high-quality, reusable, and system-aligned solutions.

Jatin Fultaria
VP of IP Engineering

Jatin Fultaria has been promoted to VP of IP Engineering and will lead Baya’s India site, strengthening our global engineering presence and execution capabilities. Jatin plays a key role in scaling engineering delivery and supporting customers across the full implementation cycle

Together, this leadership team enhances Baya’s ability to bridge the gap between architecture and implementation, enabling partners to build and deploy complex AI and chiplet-based systems with greater speed, efficiency, and confidence.

About Baya Systems

Baya Systems is leading the next wave of foundational, high-performance, and modular semiconductor systems technologies that are chiplet-ready and accelerate intelligent compute everywhere. Inspired by the baya bird’s nest-weaving ability, Baya integrates best-in-class compute, communication, and I/O components into seamless, energy-efficient solutions. Its software-based design and exploration platform enhances performance, yield and reusability, enabling cutting-edge, cost-effective innovation across multiple industries. A member of the EE Times 2025 Silicon 100 and recipient of Frost & Sullivan’s 2025 Technology Innovation Leader award in semiconductor IP interconnect, and winner of the 2025 EPDT Product of the Year Award,  Baya is ISO 9001:2015 certified and backed by leading investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital. For more information, visit https://bayasystems.com or follow us on LinkedIn.