AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure

• More than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging capabilities for AI infrastructure
• Industry-leading EFB-based 2.5D packaging to enable higher interconnect bandwidth and efficiency in 6th Gen AMD EPYC CPUs, codenamed “Venice”
• AMD Helios rack-scale platform with “Venice” and AMD Instinct MI450X GPUs on track for multi-gigawatt deployments beginning 2H 2026

SANTA CLARA, Calif., May 21, 2026 -- To meet the growing demand for AI infrastructure, AMD (NASDAQ: AMD) today announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure.

Working with strategic partners in Taiwan and globally, AMD is advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems. These efforts build on AMD’s deep ecosystem partnerships and long-standing leadership in chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding and rack-scale system design for next-generation AI infrastructure. 

“As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand,” said Dr. Lisa Su, Chair and CEO, AMD. “By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems.” 

Today’s investment announcement demonstrates how AMD is extending its leadership through strategic partnerships that advance silicon, packaging and manufacturing innovations required for next-generation AI infrastructure:

• EFB ecosystem development: AMD is collaborating with Taiwan-based ASE and SPIL, as well as other industry partners, to develop and qualify next-generation wafer-based 2.5D bridge interconnect technology. EFB architecture increases interconnect bandwidth and improves power efficiency, supporting “Venice” CPUs. These improvements translate into faster, more efficient systems capable of delivering greater performance-per-watt while operating within real-world power and cooling constraints.
• Panel-based innovation with PTI: AMD has achieved a major milestone with PTI by qualifying the industry’s first 2.5D panel-based EFB interconnect. The technology supports high-bandwidth interconnect at scale, allowing customers to deploy more efficient AI systems while improving overall economics.

Together, these advancements reinforce AMD’s leadership in delivering high-performance AI infrastructure at scale. By combining silicon innovation with a robust global ecosystem, AMD is enabling customers to accelerate deployment of the next generation of AI systems.

Ecosystem Accelerates AMD Helios Deployment

AMD and its ecosystem partners are applying these innovations to support deployment of the AMD Helios rack-scale platform in the second half of 2026, marking a major step toward production-ready AI infrastructure.

Leading ODM partners including Sanmina, Wiwynn, Wistron and Inventec are helping to build AMD Helios-based systems powered by AMD Instinct™ MI450X GPUs, 6th Gen AMD EPYC™ CPUs, advanced networking solutions and the AMD ROCm™ open software stack, helping scale the platform from design to high-volume manufacturing.

The AMD Helios platform is designed to deliver breakthrough AI performance through advances in compute, interconnect bandwidth, memory capacity and system-level integration, allowing customers to run larger, more complex AI workloads faster while optimizing power and efficiency.

“Sanmina is proud to partner with AMD to deliver next-generation AI infrastructure at scale,” said Jure Sola, Chairman and CEO, Sanmina Corporation. “Our work together on AMD Helios manufacturing highlights the strength of the ecosystem and our shared commitment to delivering high-performance, reliable solutions to customers worldwide.”

“Wiwynn's collaboration with AMD on the Helios platform reflects our commitment to delivering fully integrated, rack-scale AI infrastructure,” said William Lin, President and CEO of Wiwynn. “Together, we are empowering hyperscalers to deploy AI at scale with the performance, efficiency and reliability the market demands.”

“Inventec is pleased to collaborate with AMD on delivering high-performance AI and data center systems,” said Jack Tsai, President, Inventec. “Together, we are enabling customers to deploy powerful, energy-efficient infrastructure to support increasingly complex workloads.”

“Our collaboration with AMD on Elevated Fanout Bridge technology represents a significant step forward in scaling advanced packaging for high-volume applications,” said Steven Tsai, Senior Vice President, Sales, ASE. “By working together to industrialize EFB, we are enabling greater performance, efficiency and flexibility for next-generation data center platforms.”

“SPIL is proud to partner with AMD to bring innovative packaging solutions like EFB to market,” said John Yu, Vice President, Sales, SPIL. “These technologies are helping expand the reach of advanced packaging into new applications while supporting the rapid growth of AI infrastructure.”

“Through our work with AMD on panel-based EFB, we are delivering new levels of scalability and cost efficiency for advanced packaging,” said DK Tsai, Chairman, PTI. “This collaboration enables faster time-to-market and supports the high-volume production requirements of next-generation processors like ‘Venice.’”

“Unimicron is pleased to support AMD with advanced substrate solutions as packaging requirements become increasingly complex for high-performance computing,” said Kevin Chen, President of Substrate BU, Unimicron Technology Corp.

“AIC is proud to work closely with AMD on the Helios program, supporting the mechanical architecture that helps bring this advanced AI infrastructure platform to life,” said Michael Liang, Chairman, AIC. “Our collaboration across rack-level and compute tray design reflects the strength of our partnership with AMD and our shared commitment to delivering scalable, high-performance solutions for the next generation of AI.”

“Nan Ya PCB values its collaboration with AMD and is committed to supporting advanced packaging growth through high-quality substrate technology, manufacturing excellence and resilient supply chain execution,” said Jack Lu, President, Nan Ya PCB.

“Kinsus is proud to support AMD’s advanced packaging growth with high-quality substrate technology and trusted supply chain collaboration,” said Scott Chen, President, Kinsus.

About AMD

AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com.