Advanced Packaging Evolution: Chiplet and Silicon Photonics-CPO

By Vincent Lin - Director, Corporate R&D (ASE)

January 8, 2025

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Today, OSAT (Outsourced Semiconductor Assembly and Test) is driven not only by the packaging demands of advanced node ICs but also by the rise of emerging technologies like Silicon Photonics and Co-Packaged Optics. ASE has introduced a Silicon Photonics packaging platform designed to deliver innovative solutions that facilitate more advanced AI systems while ensuring high performance and energy efficiency.

The Need for Improving Computing Performance while Enhancing Energy Efficiency

In the rapidly evolving world of artificial intelligence, the current training cycle hinges on three core processes: data collection, data connection, and leveraging High-Performance Computing (HPC) for AI training and inference.

To read the full article, click here