Chiplet Technical Papers

LaMoSys3.5D: Enabling 3.5D-IC-Based Large Language Model Inference Serving Systems via Hardware/Software Co-Design

By Qipan Wang, Peking University

December 11, 2025

3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems

By Kai Zhu, EPFL

December 9, 2025

Compass: Mapping Space Exploration for Multi-Chiplet Accelerators Targeting LLM Inference Serving Workloads

By Boyu Li, University of Science and Technology of China

December 9, 2025

Chiplet technology for large-scale trapped-ion quantum processors

By Bassem Badawi, University of Innsbruck

December 3, 2025

REX: A Remote Execution Model for Continuos Scalability in Multi-Chiplet-Module GPUs

By Mario Ibáñez Bolado, Universidad de Cantabria

December 3, 2025

A 3D-integrated BiCMOS-silicon photonics high-speed receiver realized using micro-transfer printing

By Ye Gu, Ghent University

December 3, 2025

AccelStack: A Cost-Driven Analysis of 3D-Stacked LLM Accelerators

By Chen Bai, The Hong Kong University of Science and Technology

November 26, 2025

ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC

By Qipan Wang, Peking University

November 25, 2025

Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging

By Himanandhan Reddy Kottur, University of Florida

November 25, 2025

Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging

By Taejoon Noh, Sungkyunkwan University

November 24, 2025

Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism

By Cong Wang, The Hong Kong University of Science and Technolog

November 21, 2025

Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond

By Paul Scheffler, ETH Zurich

November 20, 2025

Sangam: Chiplet-Based DRAM-PIM Accelerator with CXL Integration for LLM Inferencing

By Khyati Kiyawat, University of Virginia

November 18, 2025

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

By Emad Haque, Arizona State University

November 17, 2025

3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence

By Eren Kurshan, Princeton University

November 14, 2025

Mastering multi-physics effects in 3D IC design

By Todd Burkholder, Siemens EDA

November 10, 2025

PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration

By Yue Jiet Chong, National University of Singapore

November 7, 2025

Optimizing Attention on GPUs by Exploiting GPU Architectural NUMA Effects

By Mansi Choudhary, Duke University

November 6, 2025

Inter-chip Clock Network Synthesis on Passive Interposer of 2.5D Chiplet Considering Transmission Line Effect

By Tai Yan, Beihang University

November 5, 2025

Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim

By Wajid Ali, University of Engineering and Technology

November 4, 2025