Inside The World Of Advanced Packaging
By Mark LaPedus, Semiecosystem (January 2, 2025)
Bob Patti, president and chief executive of NHanced Semiconductors, sat down with Semiecosystem to discuss the future of Moore’s Law, advanced packaging, chiplets and Foundry 2.0. Patti also outlined the expansion plans at U.S.-based NHanced, a pure-play advanced packaging foundry. The company’s manufacturing capabilities include 3DICs, chiplets, interposers and other technologies.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
- SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
Latest News
- Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets
- SEMIFIVE Strengthens AI ASIC Market Position Through IPO “Targeting Global Markets with Advanced-nodes, Large-Die Designs, and 3D-IC Technologies”
- FormFactor Expands Silicon Photonics Test Capabilities With Acquisition of Keystone Photonics
- NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
- PulseForge Announces Availability of PD700 SA – A Semi-Automated Photonic Debonding Tool Optimized for Large-Panel Advanced Packaging