Scaling a chiplet-based quantum processor toward fault-tolerance
By Andrew Bestwick, Rigetti Computing
Rigetti Computing's modular quantum processors scale to large qubit counts by interconnecting high fidelity, small scale superconducting quantum devices via intra-chip tunable couplers. In this talk, I will discuss Rigetti's progress in building and integrating such QPUs by scaling chiplets laterally, allowing for steady manufacturing yield and good performance up to very large systems. I will conclude with Rigetti's roadmap toward fault-tolerance with this architecture.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Scaling Open Compute: RISC-V, Chiplets, and the Future of AI and Robotics
- Design and Assembly of an Automotive-Grade Chiplet-Based Multiple Systems-on-Chip
- Thermal Simulator for Advanced Packaging and Chiplet-Based Systems
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling
Latest Videos
- Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026
- How to accelerate innovation in IC technology with chiplets and 3D ICs
- Automated Multiphysics for 3D IC Success
- Tying Together Chiplets using Network-on-Chip
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling