Sam Naffziger on Modular Design
Sam Naffziger, AMD SVP and Corporate Fellow, and Mark Papermaster, AMD CTO talk about chiplets. How you break up semiconductors into components that you can put together in novel ways and defy the slowing of Moore’s Law.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- How AMD is re-thinking Chiplet Design
- Splitting the Die A Modular Approach to Chiplet Design and Verification
- Thermal Comparison between Monolithic and Chiplet ASIC Design
- How Chiplets will Revolutionize the Electronic Design World
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets