GSCM 2024: Interview with A.M. Fitzgerald and Associates' Alissa Fitzgerald
In this interview, Nitin Dahad sat down with Alissa Fitzgerald to talk about through-silicon vias, chiplets, 3D-ICs, and how these "new" technologies originated from MEMS technologies developed decades ago.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Live with Cadence talking AI, Chiplets, Virtual Prototyping and more at Embedded World 2024
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
Latest Videos
- Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026
- How to accelerate innovation in IC technology with chiplets and 3D ICs
- Automated Multiphysics for 3D IC Success
- Tying Together Chiplets using Network-on-Chip
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling