Data Routing In Heterogeneous Chip Designs
Ensuring data gets to where it's supposed to go at exactly the right time is a growing challenge for design engineers and architects developing heterogeneous systems. There is more data moving around these chips with dozens of targets, which makes routing signals much more complicated. Ronen Perets, senior product marketing manager at Cadence Design Systems, talks with Semiconductor Engineering about some of the new problems engineers are likely to encounter with multi-vendor chiplets, what can happen when communication is not consistent, and the impact of multiple communications links between each routing node.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Chiplet Bonding – Heterogeneous Integration
- Paving the Road Ahead: RISC-V and Chiplet Technologies in Modern Automotive and Data Center Architectures
- Heterogeneous 2.5/3D Chip Design Requires Integrated Tools
- Analyzing Packet Data Flow in Chiplet Based SoCs
Latest Videos
- Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026
- How to accelerate innovation in IC technology with chiplets and 3D ICs
- Automated Multiphysics for 3D IC Success
- Tying Together Chiplets using Network-on-Chip
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling