Charting Architectural Innovation in the Chiplet Era with OCP's Cliff Grossner
TechArena host Allyson Klein chats with OCP’s Cliff Grossner regarding the chiplet era, how architectural evolution has evolved to a chiplet economy, and how the OCP is helping create an open marketplace for innovation.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Advancing AI: The Role of HBM in the Chiplet Ecosystem Era
- Driving AI Innovation with Chiplet Standards
- Unlocking the Future of Chiplet Innovation
- Introducing the UCIe™ 3.0 Specification: Continued Innovations in the Open Chiplet Ecosystem
Latest Videos
- Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026
- How to accelerate innovation in IC technology with chiplets and 3D ICs
- Automated Multiphysics for 3D IC Success
- Tying Together Chiplets using Network-on-Chip
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling