Sam Naffziger on Modular Design
Sam Naffziger, AMD SVP and Corporate Fellow, and Mark Papermaster, AMD CTO talk about chiplets. How you break up semiconductors into components that you can put together in novel ways and defy the slowing of Moore’s Law.
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- How AMD is re-thinking Chiplet Design
- Splitting the Die A Modular Approach to Chiplet Design and Verification
- Thermal Comparison between Monolithic and Chiplet ASIC Design
- How Chiplets will Revolutionize the Electronic Design World
Latest Videos
- From ASIC Startups to Chiplets: Decades of Semiconductor Leadership and Innovation | Kash Johal
- Chiplet Quilting for the Age of Inference
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
- Scaling a chiplet-based quantum processor toward fault-tolerance
- Splitting the Die A Modular Approach to Chiplet Design and Verification