Linking Semiconductor Design to Manufacturing for a Sustainable Future
Semiconductor sustainability is heavily impacted by design decisions, especially as the industry transitions to heterogeneous chiplet integration using 2.5/3D substrates for continued scaling. Linking digital twins of semiconductor design and fabs allows a bi-directional flow - design details optimize fabs for sustainability, while manufacturing data optimizes design libraries and decisions.
Listen in as EE Times' Sally Ward-Foxton and Siemens EDA's Michael Munsey discuss - Semiconductor design: Linking design to manufacturing for a sustainable semiconductor future.
Related Videos
- China Target Chiplet, will it be a shortcut for China semiconductor self sufficiency？
- Why chiplet will transform the semiconductor ecosystem from design to packaging?
- Chiplets for the future of AI
- Accelerating AI Innovation with Arm Total Design: A Case Study
Latest Videos
- The Democratization of Co-Design (DeCoDe) for Energy-Efficient Heterogeneous Computing
- With Moore’s Law Slowing Down—Chiplets Rebooting The Semiconductor Industry, BJ Han - Silicon Box
- Trends in 2025 Chiplet Design
- Custom Tool Development Strategies for Chiplet Reliability
- Imec Automotive Chiplet Forum 2025: Interview with Arm's John Kourentis