Linking Semiconductor Design to Manufacturing for a Sustainable Future
Semiconductor sustainability is heavily impacted by design decisions, especially as the industry transitions to heterogeneous chiplet integration using 2.5/3D substrates for continued scaling. Linking digital twins of semiconductor design and fabs allows a bi-directional flow - design details optimize fabs for sustainability, while manufacturing data optimizes design libraries and decisions.
Listen in as EE Times' Sally Ward-Foxton and Siemens EDA's Michael Munsey discuss - Semiconductor design: Linking design to manufacturing for a sustainable semiconductor future.
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
- China Target Chiplet, will it be a shortcut for China semiconductor self sufficiency？
- Why chiplet will transform the semiconductor ecosystem from design to packaging?
- Enabling a true open ecosystem for 3D IC design
Latest Videos
- From ASIC Startups to Chiplets: Decades of Semiconductor Leadership and Innovation | Kash Johal
- Chiplet Quilting for the Age of Inference
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
- Scaling a chiplet-based quantum processor toward fault-tolerance
- Splitting the Die A Modular Approach to Chiplet Design and Verification