The chiplet future could be harmonious
By Caroline Hayes, Electronics Weekly | July 17, 2025
There is a general consensus and belief that chiplets are the future, said Abhijeet Chakraborty, VP engineering, Synopsys. There are, however, no illusions about some of the challenges or obstacles that have to be addressed, he added.
The first of these is interoperability and standards. Access to chiplets is essential to design any complex, large system, Chakraborty told Electronics Weekly shortly after participating in a chiplets panel discussion at DAC. “While there are many vendors, the customer has to various tradeoffs, such as cost, which package to use, 2.5D or vertical stacking, thermal issues and power profiles, as well as how to model and how to represent them,” he said.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
- Does This Chip Hold the Future of the Semiconductor Industry?
- NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
- YorChip predicts 2026 will be the year of the chiplet
Latest News
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics
- Tata and Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India
- Marvell Eyeing Connectivity as the Next Big Thing in AI
- Rebellions and Red Hat Introduce Red Hat OpenShift AI Powered by Rebellions NPUs to Fuel Choice and Flexibility in Enterprise AI