How and Why Chiplets are Growing in Use and Need
By Ken Briodagh, Embedded Computing Design (May 6, 2024)
Ever since Gordon Moore made his eponymous prediction in 1965, it’s been inevitable that we would reach an end to the ability to keep doubling the processing in individual chips, if only because of the laws of physics (at the macro scale anyway – we’ll cover quantum computing another time!).
Since Moore has been so reliably correct, well beyond even the time when many early doomsayers said we’d hit the limits, mostly thanks to advancements in materials science and electrical engineering, there haven’t been many solutions presented to the problem of reaching that Moore horizon. In fact, many times when the topic comes up it’s not unusual to see shrugging shoulders and waved hands as the majority responses. If ain’t broke (yet), why fix it?
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
- YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
- Chiplets Market to Reach USD 107.0 Billion by 2033; Amid Rising Demand for Advanced Semiconductor Solutions
- Boom predicted for chiplet market
Latest News
- Marvell Eyeing Connectivity as the Next Big Thing in AI
- Rebellions and Red Hat Introduce Red Hat OpenShift AI Powered by Rebellions NPUs to Fuel Choice and Flexibility in Enterprise AI
- Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance
- CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration
- Qualcomm Acquires Ventana Micro Systems, Deepening RISC-V CPU Expertise