Can Chiplets Serve Cost-Conscious Apps?
The economics are not yet clear for industrial or consumer electronics.
By Bryon Moyer, Semi Engineering | April 17th, 2025
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption.
One of the main reasons for the cost increase is the need for advanced packaging when employing chiplets, which represents a fundamental shift in how semiconductors are designed, built, and tested. It requires extra time, effort, expertise, and experimentation, because there are no set recipes. Standards eventually may help mitigate the risk, but it’s not clear whether the cost of advanced packaging will ever beat that of traditional packaging.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Can Chiplets Solve Semiconductor Challenges?
- Chiplets Make Case for More Apps
- Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
Latest News
- TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics
- Tata and Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India
- Marvell Eyeing Connectivity as the Next Big Thing in AI