AI Chips Shifting from Round to Rectangular
By Alan Patterson, EETimes | October 16,2025
The advanced-packaging needs of AI chips are driving a move by the semiconductor tool and material industry to supply rectangular panels aimed at taking market share from the round silicon wafers we are all so familiar with.
Toolmakers Lam Research and Nikon are among companies selling components for panel production, with an expected business takeoff starting as early as 2027, according to Lam.
Top foundry TSMC, which has dominated advanced packaging of AI chips for customers like Nvidia and AMD, is likely to yield its hegemony of heterogeneous integration to OSATs (outsourced semiconductor assembly and test companies) that are preparing to grab more of the business, according to Lam.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- AI Pushes High-End Mobile From SoCs To Multi-Die
- Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing
- Arm and Meta Deepen Strategic Partnership to Power the Next Era of AI, from Megawatts to Milliwatts, for Billions Worldwide
- AI Boom Drives Demand for Ultra-Large Packaging as ASICs Expected to Shift from CoWoS to EMIB, Says TrendForce
Latest News
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics
- Tata and Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India
- Marvell Eyeing Connectivity as the Next Big Thing in AI
- Rebellions and Red Hat Introduce Red Hat OpenShift AI Powered by Rebellions NPUs to Fuel Choice and Flexibility in Enterprise AI