Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
By Ed Sperling And Laura Peters - Semiconductor Engineering (January 29th, 2025)
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising
- SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
Latest News
- Marvell Eyeing Connectivity as the Next Big Thing in AI
- Rebellions and Red Hat Introduce Red Hat OpenShift AI Powered by Rebellions NPUs to Fuel Choice and Flexibility in Enterprise AI
- Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance
- CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration
- Qualcomm Acquires Ventana Micro Systems, Deepening RISC-V CPU Expertise